- Features latest Intel® Core™ i7 dual- and quad-core processors
- Supports multiple simultaneous displays
- Ruggedization allows deployment in harshest environments
CHARLOTTESVILLE, VA July 26, 2012 GE Intelligent Platforms (NYSE: GE) today announced the latest addition to the company's growing range of COM Express modules with the launch of its highest performance offering to date, the rugged bCOM6-L1400. Taking advantage of the significant processing and graphics capabilities of the recently-announced Intel® Core™ i7 processor, the bCOM6-L1400 can support multiple independent displays in a wide variety of commercial, industrial, transportation and defense applications in a broad range of embedded computing environments.
The launch of the bCOM6-L1400 further expands GE's range of rugged COM Express solutions following a series of announcements. The most recent of these was the launch of the rugged bCOM6-L1200 -- which features a range of five VIA Nano™ and VIA Eden™ processor options - in February.
By separating the carrier card from the processor, the COM Express architecture extends the useful life of the subsystem by allowing simple, cost-effective upgrade of the processor alone. This reduces long term cost of ownership while ensuring that performance keeps pace with changing needs.
Offered with a choice of either a dual-core or quad-core processor for maximum flexibility and enabling customers to select the optimum price-performance/watt combination for the planned application, the bCOM6-L1400 takes advantage of GE's extensive experience and expertise in the design and development of rugged COM Express modules. It also complements GE Intelligent Platforms' extensive portfolio of rugged embedded computing solutions that includes single board computers, multiprocessors, Ethernet switches, displays and networking.
The bCOM6-L1400 can be confidently deployed in the harshest, most challenging environments that are subject to extremes of temperature, vibration, shock and contaminants. Its components are specifically selected for reliable operation in hostile environments, and the processor and memory are soldered to the board for the highest possible resistance to external forces.
Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes. Sophisticated dynamic thermal management optimizes uptime and helps prevent damage to the system.
GE is able to provide customers with the support necessary to enable them to develop their own carrier card configurations, or to provide custom carrier card variants on request. This ability provides significant flexibility to systems integrators looking to create unique, high value-added solutions.
"The bCOM6-L1400 is a further example of GE's rugged high performance platform strategy in action, and of our commitment to bringing the most recent processor technologies to market as rapidly as possible," said Steve Pavlovsky, Product General Manager, Control & Communication Systems, GE Intelligent Platforms. "The COM Express architecture is ideal for OEMs looking to reduce developments costs, minimize risk and time to market and to provide the lowest possible cost of ownership. With the announcement of GE's bCOM6-L1400, those customers get not just the benefits of COM Express and of Intel's latest processor, but also outstanding performance, exceptional flexibility, remarkable robustness -- and the commitment to customer satisfaction for which GE is renowned."
As well as its graphics capabilities (VGA, LVDS with dual channel support and SDVO/TMDS/DisplayPort over DDI), the bCOM6-L1400 features up to 8GBytes of DDR3 memory, Gigabit Ethernet and four SATA interfaces, with support for both RAID 0 and RAID 1. Also provided for optimum connectivity are eight USB 2.0 ports and four USB 3.0 ports.
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For more technical information: http://www.ge-ip.com/account/download/13246/3649
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Intel is a registered trademark, and Core is a trademark, of Intel Corporation. Eden and Nano are trademarks of VIA Technologies Inc. All other trademarks are the property of their respective owners.
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