Receives >$1.3 million ARPA-E project award, aiming to reduce the timeline for designing and validating 3D- printed turbomachinery components from 2-5 yrs to 1-2 yrs.

Putting optimal back on the table for real applications using Quantum as an accelerator

Keeping workers safe through analytics derived from sensor data fusion & aggregation and delivered through pervasive connectivity & real-time visualization

Findings reported in the cover story of the May 2020 issue of Nature Electronics

Arun Gowda is the SiC Mission Leader and Principal Engineer responsible for packaging development and deployment of GE's SiC technology into applications. Prior to this role, Arun led the Electronics Packaging and Miniaturization lab at GE Research, responsible for the development of advanced packaging and integration of microelectronics, sensors, and power devices.

GE Research teams up with NYSID and the Center for Disability Services in Albany to supply 400 face shields to Albany Medical Center.

GE- led team to demonstrate embedded sensors in structural composite materials to improve manufacturing and monitoring of parts and components from factory to field

Mr. Kapusta is a Principal Process Development Engineer in GE Research's Microelectronics Laboratory, focused on the fabrication processes and system integration of next generation electronics packages and interconnect technologies. He earned his Bachelor of Science Degree in Chemistry at the State University of New York Oswego in 1996.

Low-cost manufacturing platform for disposable, hospital-grade multi-parameter clinical monitoring devices.

GE Research's multi-gas sensors share the mathematical principles of traditional analytical instruments without their large power, size, and cost limitations.