Dr. Ghaemi received the Ph.D. degree in electrical engineering and the M.S. degree in mathematics from University of Michigan in 2010 and 2009 respectively. He was a visiting scholor at ETH in 2008. From 2010 to 2012 he was a post-doctoral associate in the Mechanical Engineering department at MIT, researching supervisory control of order-preserving systems and stochastic analysis of biological systems.
Matthew Seidel graduated from Clarkson University with a B.S. in Electrical Engineer and Physics. After graduating, Matthew has gained over 5 years of embedded system design experience in both the commercial and defense sectors. His areas of specialization are in FPGA design, high speed digital board design, and embedded programming.
Currently, Matthew is helping in the areas of hardware cyber security, machine learning, and high speed image acquisition.
Arun Gowda is the SiC Mission Leader and Principal Engineer responsible for packaging development and deployment of GE's SiC technology into applications. Prior to this role, Arun led the Electronics Packaging and Miniaturization lab at GE Research, responsible for the development of advanced packaging and integration of microelectronics, sensors, and power devices.
