Peter deBock

Dr. Peter de Bock serves as Principal thermal engineer at GE Research in Niskayuna, New York. In his role Dr. deBock has over 15 years’ expe­rience in developing innovative thermal management solutions for electronics and electrical machines. He holds a PhD in ME from the University of Cincinnati and a MSME from Twente Technical University, the Netherlands. His current work is focused on developing next generation technologies for Aerospace systems. Dr. de Bock is vice-chair of the ASME K-16 committee on Heat Transfer in Electronic Equipment, a member of the Heterogenous Integration Roadmap Thermal Working Group and holds over 25 patents in the areas of heat transfer and thermal management.

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