Dr. Peter de Bock serves as Principal thermal engineer at GE Research in Niskayuna, New York. In his role Dr. deBock has over 15 years’ experience in developing innovative thermal management solutions for electronics and electrical machines. He holds a PhD in ME from the University of Cincinnati and a MSME from Twente Technical University, the Netherlands. His current work is focused on developing next generation technologies for Aerospace systems. Dr. de Bock is vice-chair of the ASME K-16 committee on Heat Transfer in Electronic Equipment, a member of the Heterogenous Integration Roadmap Thermal Working Group and holds over 25 patents in the areas of heat transfer and thermal management.