Arun Gowda

PhD, Electronics Manufacturing (Binghamton University) MS, Industrial Engineering (Binghamton University) BE, Mechanical Engineering (R.V. College of Engineering, India)

Arun Gowda is the SiC Mission Leader and Principal Engineer responsible for packaging development and deployment of GE's SiC technology into applications. Prior to this role, Arun led the Electronics Packaging and Miniaturization lab at GE Research, responsible for the development of advanced packaging and integration of microelectronics, sensors, and power devices.

Arun has 16 years of GE experience spanning various technical contributor, project leadership, and people management roles. Experienced in the areas of electronics packaging, heterogeneous integration, electronic materials, thermal management, and electronics manufacturing processes. Arun is a Six Sigma Black Belt and a TRIZ Level 3 Practitioner.

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