Join us for the 2021 Electronics Packaging Symposium, which is being held virtually this year Wednesday, September 8th, and Thursday September 9th.
We're excited to have IBM join Binghamton University, GE Research, IEEE Electronics Packaging Society, the ASE Group and IEEE Electron Devices Society in organizing this year's Symposium. The event will feature keynote presentations from two top experts in the field, Babak Sabi, Corporate Vice President and GM of Assembly/Test Development at Intel and Dale McHerron, Senior Manager for Process Strategy at IBM. The Symposium also will feature a special panel session, discussing the US Department of Defense's needs in electronics packaging that you won't want to miss.
Although the event will be virtual, all of our speakers will be presenting live and attendees will have an opportunity to interact with speakers following their talks. Also, will be using a new platform to continue a long standing tradition of our student poster session, in which students from Binghamton University, SUNY Polytechnic and other colleges can showcase their research towards advancing the field of electronics packaging.
Click here to review the full agenda and here to register.
We're here to solve your toughest problems.