GE Researchers Exploring US Army Research Lab’s ParaPower Open Source Platform to Design Advanced Silicon Carbide (SiC) Power Electronics to Improve More Electrified Vehicles and other Systems
- GE is using ARL ParaPower to aid the design of the Package Integrated Cyclone Cooler (PICCO)– an advanced cooling technology for Silicon Carbide (SiC) wide band-gap devices with superior efficiency and high temperature performance
- PICCO will enable better performance in more electrified vehicle drive systems and is part of overall effort by the US Army to deliver the most advanced military equipment and systems
NISKAYUNA, NY – January 8, 2020 -- GE Research today announced a new collaboration with the US Army Research Laboratory (ARL), based in Adelphi, MD, to co-develop a next generation thermal management solution for Silicon Carbide (SiC) pulsed Wide Band-Gap Power Devices. This collaboration will utilize co-design methodologies and tools to significantly improve the size, weight, and performance of SiC power electronics systems to support more electrified vehicles and other systems for the Army.
SiC devices play an important role for improving the efficiency and performance of power electronics for electrical actuation and electrified drive systems but can face thermal challenges that prevent their full capabilities from being utilized. A multi-disciplinary project team from GE Research and ARL with expertise in thermal management, electronics packaging and materials research will co-develop PICCO, a potentially breakthrough thermal management solution using co-design and additive manufacturing that will allow for maximum efficiency and performance with these types of advanced power devices. The project team is utilizing the open source ARL ParaPower tool, which was developed by ARL to accelerate the design and deployment of a wide range of electronic packaging and thermal management solutions for the Army.
GE’s Dr. Peter de Bock, a Principal Engineer for ThermoSciences and project leader, said the GE Research team is excited to work with ARL on their open source platform, stating, “We’re particularly excited to see how ARL ParaPower can help us bring together multiple research domains to accelerate the co-development of our PICCO technology. Implementation of PICCO has the potential to enable new levels of capability in advanced more electrified vehicles and other systems that the Army is looking to realize.”
Dr. de Bock said that applications such as more electrified vehicles’ drive systems require power electronics cooling systems to manage occasional short duration high power events that have the potential to cause an undesired rapid increase in temperature of the SiC power device. The PICCO project will focus on development of a thermal management innovation that increases the thermal inertia of the power electronics package, improving the package thermal performance such that the full capability of the SiC devices can be utilized.
The project team is looking forward to maturing the PICCO technology towards demonstration and validation in a power module and eventually applying it to an Army relevant system.
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Figure 1: ARL ParaPower software tool for electronics co-design. https://github.com/USArmyResearchLab/ParaPower/wiki
This Research was sponsored by the U.S. Army Research Laboratory's Sensors and Electron Devices Directorate (SEDD) and was accomplished under Cooperative Agreement Number W911NF1920276. The views and conclusions contained in this document are those of the authors and should not be interpreted as representing the official policies, either expressed or implied, of the U.S. Army Research Laboratory's Sensors and Electron Devices Directorate (SEDD) or the U.S. Government. The U.S. Government is authorized to reproduce and distribute reprints for Government purposes notwithstanding any copyright notation herein.