Electronics & Sensing Commercial Solutions

GE Research is a team of 1,000+ scientists and engineers, 600 with PhDs, working across multiple industries including healthcare, energy, aerospace, and defense.

For over 60 years, our Electronics and Sensing division has delivered breakthrough solutions for GE, Strategic Partners, and Government. Let us put our technology and expertise to work for you in areas that include semiconductors, microelectronics, MEMS, photonics, microsystems, microfluidics, and advanced packaging.

Commercial Offerings
End-to-End Solutions image
End-to-End Solutions

Our solutions span innovation to production and take advantage of our wide rang of capabilities, enabling us to tailor the solution to our customer’s needs. We start by understanding the application requirements that impact system and component specifications and supply chain ecosystems. The team dives deep into each level of the system to architect a solution that fits all constraints, from performance to cost to reliability.

Foundry Services image
Foundry Services

Our Electronics and Sensing division has been an innovation engine for GE, our strategic partners, and the government. Our expertise and capabilities include semiconductors, microelectronics, MEMS, photonics, microsystems, microfluidics, and advanced packaging. We are a dedicated team that is focused on and passionate about solving our customer's toughest challenges from concept to production.

  • Electronics & Sensing Cleanroom
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Device Production

We offer the opportunity to work with our team in a collaborative R&D arrangement, flexible to your business, from initial prototype development to long term supply of devices and packaging in MEMS, SiC, Optoelectronics, and Microfluidics. Our offerings include: supply from existing catalog of products, development of application specific devices with transition to long term supply, and prototypes for system proof of concepts and transition to supply chain partners.

  • Device Production
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MEMS Test Solutions

We offer a wide range of test solutions and services for MEMS and semiconductor devices.

  • Rapid MEMS Test Solutions via MEMSuite
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Device Reliability Testing

We offer unique test solutions and services for high temperature and high power semiconductor devices.

  • Harsh Environment Reliability Testing
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Advanced Packaging Solutions

We offer advanced packaging and test solutions for MEMS, SiC, Optoelectronics, and Microfluidics. Our expertise ranges from initial R&D and custom package development to process transfer to volume manufacturing facilities.

  • RF and Embedded Packaging
Industries we serve...
Aerospace image

Over the past sixty years our team has had key technology breakthroughs in multiple industries creating the foundation for our diverse portfolio. Combined with our GE Business heritage we serve many markets and segments. Our high temperature power electronic devices based on cutting-edge SiC technologies is a key enabler for the future of flight. We push the limits of today’s electronics and sensing components and systems to create differentiated and disruptive solutions for high-performance, extreme environments.

Defense & Security image

GE Research is creating microsystems that combine microelectronics, photonics, and MEMS devices that target harsh environments and highly constrained operating conditions, including size, weight and power. These microsystems provide system of system solutions in sensing and actuation for challenging military and industrial applications.

Autonomy & Communications image

GE Research is combining microelectronics and sensors on flexible substrates to enable solutions that can adapt to a wide variety of challenging operating conditions, across diverse environments from jet engines to wind turbines to the human body.

Power & Energy image

Leading Silicon Carbide (SiC) technology is creating new opportunities in the power electronics arena, particularly in harsh environment applications. The same SiC device design and process capability has also led to novel uses as both a sensor and as a building block for high temperature integrated circuits. For example, GE is using SiC photosensors to monitor gas turbine flame signatures giving energy customers improved reliability and uptime.

Healthcare image

GE Research is developing mixed signal ASICs that are at the heart of GE’s medical imaging devices. We also bring these high-performance techniques to electronic systems for advanced sensing in harsh environments that push the limits of signal-to-noise, power, and weight with custom ASICs and embedded processor designs. We are also actively researching bioelectronic medicine, exploring the use of non-invasive devices to diagnose and treat chronic diseases. These future applications will require electronics solutions that can be naturally adapted to the form and the physiology of the human body.

MEMS image

Low Loss | High Isolation | High Linearity | Integrated RF MEMS & Passives | Thru Glass Vias

GE Research has more than 15 years of experience, offering high performance and highly reliable RF MEMS on fused silica technologies.

RF MEMS Capabilities

  • Integrated RF MEMS switch element
  • • DC to 50GHz operation
  • • Greater than 3 billion cycle reliability
  • • Thin fused silica substrate with TGV (100 to 300um)
  • • Wafer level bonding of fused silica for capping
  • and multilayer module buildup
  • • Integrated passives (resistors, capacitors)
  • • Flipchip and BGA attach options available
  • • 28,000 sq. ft. class 100 cleanroom
  • • ISO 9001 2015 certified, ITAR compliant

Download Full Technology Brief - RF MEMS

Silicon Carbide Photodiode image
Explore More

300º C Operation | Ultra Low Dark Current | Visible/Solar Blind | Low Noise | Radiation Hard

GE Research has 20+ years of experience fabricating SiC PDs for harsh environment applications, with demonstrated high temperature capability (>300° C) and reliability.

SiC Photodiode Capabilities

  • 28,000 sq. ft. class 100-1000 cleanroom (ISO 9001) for the fabrication of SiC PDs on 100 mm wafers
  • PD device design and simulation capabilities
  • High temperature packaging development and fab
  • Mixed signal circuits design and integration
  • Full suite of PD device characterization capabilities
  • Highly accelerated test suite to determine long-term device reliability of device and packaging

Download Full Technology Brief - High Temperature Silicon Carbide UV Photodiode

RF Packaging image

High Reproducability | Multi-layer Thin Glass Buildup | Direct Metal Interconnect | Integrated RF MEMS & Passives | Thru Glass Vias

GE Research has 40 years of experience, providing discriminating RF and mmWave electronic integration and packaging technologies for high performance and harsh environment systems.

RF Packaging Capabilities

  • Organic and inorganic substrates
  • Lamination and wafer bonding
  • High signal integrity, fine line and space
  • TGV processing
  • Integrated passives & RF MEMS
  • Panel and wafer level processing
  • Multi-layer stacks with nm to 100 µm metal
  • MCM module assembly
  • RF module and wfer test to 70 GHz
  • Accelerated reliability and life tests
  • 28,000 sq. ft. class 100 cleanroom
  • ISO 9001:2015 certified, ITAR compliant

Download Full Technology Brief - RF Packaging 

Embedded Packaging image

High Density Interconnects | Wide Range of Materials | Direct Metal Interconnect | 10x Parasitic Reduction | RF and High Power

GE Research has 20 years of offering discriminating electronic integration technologies for high performance systems, including embedded packaging for military and industrial application spaces.

Embedded Packaging Capabilities

  • Bare die component assembly
  • Die to wafer assembly
  • Laser micro via formation
  • Flex circuit and thin film processing
  • Multi-layer capability with 4 to 100 m Cu thickness
  • High signal integrity, fine line and space
  • Accelerated reliability and life tests
  • 28,000 sq. ft. class 100 cleanroom
  • ISO 9001 2015 certified, ITAR compliant
HP Gas sensors image

Rejection of interferences | Tuned gas selectivity | Broad dynamic range | High Stability | Low power

GE Research has 20+ years of experience in developing sensors for detection of gases and vapors in diverse environments, including but not limited to groundwater wells, bioreactors, environmental remediation sites and industrial facilities.

Gas Sensor Capabilities

  • Multi-gas detection and response stability via machine learning coupled to custom transducers
  • RF, photonic, printed flexible and nano-structure transducers
  • Detected classes of gases and vapors: Industrial, environmental, homeland security, biomedical, food safety, e.g. H2, H2S, CH4, C2H6, C3H8, CO, C2H2, O3, NH3, NOx, methanol, ethanol, toluene and others.
  • Urban and rural surveillance of atmospheric pollutants at ppm - ppb levels H2S, CO, O3, NH3, NOx and CH4
  • Use cases in wearable, stationary and UAV industrial safety systems for flammable and toxic gases
  • Systems solutions for low and near- zero power, including sensor networks

Download Full Technology Brief - High Performance Gas Sensors

 

 

Inertial sensing image

Low drift, Low ARW | Gyrocompassing | Navigation grade | Thick silicon SOI | Wafer level vacuum seal

GE Research develops high performance, navigation grade MEMS inertial sensors targeted for autonomous systems in GPS denied harsh environments.

Inerttial MEMS Capabilities

  • Navigation grade MEMS gyroscope
  • Co-located MEMS gyroscope and accelerometer
  • MEMS gyrocompassing with <0.5º heading accuracy
  • High temp capable MEMS with control electronics
  • High aspect ratio, thick silicon (>100um) SOI process
  • Wafer level vacuum capping
  • Thru-silicon via (TSV)
  • 28,000 sq. ft. class 100 cleanroom
  • ISO 9001:2015 certified, ITAR compliant

Download Full Technology Brief - Inertial Sensing

saw torque image

High Accuracy | Direct Signal Response | Small Size, Low Mass | Industrial Reliability | Harsh Environment

The Microsystems team at GE Research, in conjunction with Transense Technologies Plc, developed the device integration, system level design, modeling and fabrication methodologies to provide a highly robust sensing solution utilizing surface acoustic wave technology (SAW) for challenging military and industrial applications.

SAW Capabilities

  • Increased controllability provided by direct strain for improved operational efficiency and life.
  • Minimal impact to rotor dynamics
  • System axial lengths of <1” for dual redundant systems
  • Shaft diameters from <3” to > 3’
  • -55°C to 200°C rated system (Higher temp offerings under development)
  • 28,000 sq. ft. class 100 cleanroom
  • ISO 9001:2015 certified
  • ITAR compliant

Download Full Technology Brief - SAW RF Strain and Temperature Sensing System

Integrated photonics image

Elimination of fiber routing and splicing | New photonic system applications | Reduction in Line Replaceable Units (LRUs) | Low-cost at volume | Low size, weight & power

GE Research has over 20 years of experience developing photonic and fiber optic system solutions, packages, components and analytics for military and industrial applications. In recent years, it has leveraged this experience to develop photonic integrated circuits (PICs) and related heterogeneous packages for energy, healthcare, and aviation applications.

Integrated Photonics Capabilities

  • Photonics modeling/design software and expertise (Synopsys RSOFT, Phoenix OptoDesigner, Zemax)
  • Optical packaging tools including MRSI and Lambda FineTech die bonders and Panasonic flip chip bonder
  • Optical/Electrical probe station with temperature and automated XYZθ platen control for up to 300mm wafers
  • 6-axis Phsyik Instrumente Fiber Alignment System with H-811 Hexapod and NanoCube Nanopositioner
  • Labview test automation
  • SAS JMP data analysis
  • 28,000 sq. ft. class 100 cleanroom

Download Full Technology Brief - Integrated Photonics

 

Our History
  • Silicon Carbide Photodiode image

    SEM image of SiC photodiode.

    Silicon Carbide Photodiode

    We developed high temperature SiC photodiodes at GE Research.

Contact Us

We are ready to partner with you...

We are a dedicated team that is focused on and passionate about solving our customers’ toughest challenges from concept to production. We offer the opportunity to work with our team in a collaborative R&D arrangement, flexible to your business, or more directly through one of our core services.

COMMERCIAL PROGRAM MANAGER
Marissa Dannible

Marissa Dannible

 (518) 387-4165

  [email protected]

 
1 Research Circle
Room: KW C300A
Niskayuna NY 12309-1027 US

We're ready to partner with you. 

Contact Us